Multipolar Cuff
Electrodes with Integrated Pre-amplifier & Filter to Interface
Peripheral Nerves for
Ramachandran A1, Sacristan J2, Lago N3,
Dörge T1, Navarro X3, Osés MT2, Koch KP1, Hoffmann KP1.
1 Neural Prosthetics Group, Fraunhofer - IBMT, Ensheimer Str. 48, D-66386
St.Ingbert, Germany.
2 Centro Nacional de Microelectrónica, Campus UAB, 08193
Bellaterra, Spain.
3 Dept. Cell
Biology, Physiology and Immunology, and
E Mail: anup.ramachandran@ibmt.fraunhofer.de,
jordi.sacristan@cnm.es
Flexible, 4-channel, polyimide based cuff electrodes for
Decades of research centered on neuroprosthetic
A novel class of 4-channel polyimide cuff electrodes with integrated
pre-amplifier and filter has been designed for various cuff diameters. The
substrate design could be folded in such a way as to behave like a double sided
metallization. In this paper we present the design of the cuff electrode with
the first in vitro investigation, the structure for the implantable
amplifier with filter for ENG signals, and the characterization of the cuff
electrodes.
The polyimide cuff electrodes with amplifier (Fig.
1) are 5.3cm long and 1.5cm wid
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Fig. 1: Polyimide cuff substrate
(1.6 mm dia.) after metallization of electrodes and conductive lines
with amplifier before assembling. |
A
ground electrode of 2.9mm2 surface area was incorporated
in the design (Fig.
2). The ground electrode was bend backwards to form a
metallic ring on the outer side of the polyimide cuff.
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Fig. 2: Schematic representation of
electrodes with the polyimide cuff opened.
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Fig. 3: Schematic of distal end of
the cuff electrod |
The electrodes and the
conductive lines are fabricated through
established photolithographic techniques [3]. The process begins with spin
coating of 5µm thick polyimide (Pyralin PI 2611, HD microsystems) layer on a silicon
wafer. This is followed by the sputter deposition and photolithographic
patterning of platinum (thickness of 300 nm) over the polyimide to form
conductive lines and electrode sites. For insulating the lines, a second
polyimide layer of 5µm was spin coated over the metallization. The electrode
sites and contact pads are opened through reactive ion etching (RIE) as a final
step. The foils are separated from the silicon wafer mechanically. One die-IC
that includes pre-amplifier with filter and four surface mount ceramic multilayer
capacitors are integrated to the foil through Microflex bonding [3].
The amplifier used (Fig. 1) is a very low noise amplifier with
a filter [4] designed to have an input referred noise equal to the equivalent
thermal noise of 1.5kW (the electrode
impedance). Fig.
4 shows a simplified schematic of the full amplifier
structur
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Fig. 4: Structure of the full
amplifier for the recording ENG signals. |
The second stage is based on
a differential differences amplifier (DDA). This amplifier filters the
differential signal from first stage and it is capable of eliminating the
residual offset. The filter is used to reduce signals outside the band (100Hz-5kHz)
and has been implemented without any external component. The low cut-off
frequency has been designed with a 20pF internal capacitor and a PMOS transistor operating in
subthreshold that emulates a resistor of 100MW. This low cut-off frequency
can be digitally programmed to four different frequencies to adapt the
amplifier to the input signal.
The last stage consists of
an RC filter followed by an op-amp with fixed gain that adapt the signal for
the output. The filter eliminates any residual offset and the cut-off frequency
is programmable as in the second stag
3.1 Cuff electrode
The polyimide cuff electrode design was completed and polyimide
substrates were fabricated. Several features were incorporated to the design of
the cuff such as microflex pads for integration of pre- amplifier, one side
access of cuff electrodes and common pad for black platinization of electrodes.
Additionally a ground electrode was incorporated for bipolar differential
recording, which was fabricated in a single metallization that would reduce the
cost of the cuff electrod
3.2 Results for amplifier
Fig. 5 shows a picture of the full 4‑channel
amplifier. It was characterized in the laboratory and the performances are
shown in the Tab. 1.
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Fig. 5: Picture of the full 4-channel amplifier with filters for recording ENG
signals. ASIC area with
pads 3.2x2.8mm2, CMOS 0.7mm. |
Tab. 1: Measured parameters for the
ENG amplifier.
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Parameter |
Measured |
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Gain [dB] |
76, 80, 96, 102 |
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Low-cut off Freq [Hz] |
106,119,201,352 |
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High-cut off Freq [kHz] |
5 |
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CMRR [dB@1kHz] |
94 |
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Equivalent input referred noise [nV/sqrt(Hz)] |
5.1 |
This
amplifier was used in acute experiments in rats. Fig. 6 shows the recording of bursts of nerve action
potentials recorded from the polyimide cuff placed around the sciatic nerve of
a rat, in response to light touch stimuli applied to the animal’s paw.
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Fig. 6: Nerve action potentials, recorded with a cuff electrode in the sciatic
nerve, evoked by touch stimuli
to the plantar surface of the rat’s hindpaw.
One burst is displayed at the right at expanded
time scal
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Four channel cuff electrodes with incorporated amplifier and filter for
recording ENG signals were realized. The dimensions of the cuff electrode are
suitable for easy handling during acute applications. The conductive lines were
connected to the electrodes through one side, this could facilitate cuff
implantation around the nerv
The electrical parameters for the amplifier and initial results of
acute experiments in rats have been presented. These results further demostrate
the suitability of this pre-amplifier for implantable cuffs to record ENG
signals of few microvolts in amplitud
[1] Victor
Fenik, Polina Fenik, Leszek Kubin. A simple cuff electrode for recording and
stimulation in acute experiments on small animals. Journal of Neuroscience Methods. 106: p. 147-151, 2001.
[2] Schuettler M, Koch KP, Stieglitz T, et al.
Multichannel Neural cuff electrode with integrated
multiplexer circuit. Proceedings of
1st annual international IEEE-EMBS conference on
Microtechnologies in Medicine Medicine & Biology. pp.624-’29, oct 12-14,
2000.
[3] T. Stieglitz, H. Beutel, M.
Schuettler and J. U. Meyer. Micromachined, polyimide-based devices for flexible neural interfaces. Biomedical Microdevices,
2001. 2(4):
p. 283-94.
[4] Sacristán J, Osés MT. Low Noise Amplifier for Recording ENG Signals in
Implantable Systems. ISCAS, BIO-L2.4(IV-33), 2004.
This
work has been supported by ESPRIT Cyberhand project IST-2001-35094.